Ceramic Ball and Grid Array

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• Ball grid array — For other uses, see BGA (disambiguation). Intel Embedded Pentium MMX (bottom view) A ball grid array (BGA) is a type of surface mount packaging used for integrated circuits. Contents …   Wikipedia

• Ball Grid Array — Zwei CPLDs in MBGA Bauweise auf einem USB Stecker. Gut zu erkennen sind die Lotperlen mit einem Abstand von 0.5 mm …   Deutsch Wikipedia

• Pin grid array — A pin grid array, often abbreviated PGA, refers to the arrangement of pins on the integrated circuit packaging. In a PGA, the pins are arranged in a square array that may or may not cover the bottom of the package. The pins are commonly spaced… …   Wikipedia

• Mathematics and Physical Sciences — ▪ 2003 Introduction Mathematics       Mathematics in 2002 was marked by two discoveries in number theory. The first may have practical implications; the second satisfied a 150 year old curiosity.       Computer scientist Manindra Agrawal of the… …   Universalium

• Business and Industry Review — ▪ 1999 Introduction Overview        Annual Average Rates of Growth of Manufacturing Output, 1980 97, Table Pattern of Output, 1994 97, Table Index Numbers of Production, Employment, and Productivity in Manufacturing Industries, Table (For Annual… …   Universalium

• CBGA — abbr. Ceramic Ball and Grid Array (IC) comp. abbr. Ceramic Ball Grid Array …   United dictionary of abbreviations and acronyms

• Alpha 21164 — Four 300 MHz Alpha 21164 microprocessors on a Cray T3E 600 processor board. The Alpha 21164, also known by its code name, EV5, is a microprocessor developed and fabricated by Digital Equipment Corporation that implemented the Alpha instruction… …   Wikipedia

• Chip carrier — A standard sized 8 pin dual in line package (DIP) containing a 555 timer IC. A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or… …   Wikipedia

• Prozessorgehäuse — ICs in DIP Gehäusen Die Ummantelung eines (ungehäusten) Halbleiterchips (ein sog. Die) inklusive der Anschlussstellen (Leads, Pins oder Balls) bezeichnet man als Gehäuse oder Package. Es existieren zahlreiche Variationen solcher Gehäuse, die sich …   Deutsch Wikipedia

• Schaltkreisgehäuse — ICs in DIP Gehäusen Die Ummantelung eines (ungehäusten) Halbleiterchips (ein sog. Die) inklusive der Anschlussstellen (Leads, Pins oder Balls) bezeichnet man als Gehäuse oder Package. Es existieren zahlreiche Variationen solcher Gehäuse, die sich …   Deutsch Wikipedia

• Surface-mount technology — (SMT) is a method for constructing electronic circuits in which the components (SMC, or Surface Mounted Components) are mounted directly onto the surface of printed circuit boards (PCBs). Electronic devices so made are called surface mount… …   Wikipedia